Product Features:

Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards

Product Structure:

Application Scenario:

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    • Product Parameters:

    东溢型号胶厚(um)涂布基材类型应用范围包装规格
    Product ModelAD   ThicknessCoated   Film TypeApplicationPacking Spec.
    PH15-250K(F)15Release  film钢片SUS250mm*100m
    PH20-250K(F)20Release  film钢片SUS250mm*100m
    PH20-500K(F)20Release  film钢片SUS500mm*100m
    PH25-250K(F)25Release  film钢片SUS250mm*100m
    PH25-500K(F)25Release  film钢片SUS500mm*100m
    PH25-250K(S)25Release  film钢片SUS250mm*100m
    PH25-500K(S)25Release  film钢片SUS500mm*100m
    PH25-250A1(A) 25Release  filmPI/FR4250mm*200m
    PH25-500A1(A) 25Release  filmPI/FR4500mm*100m
    PH35-250K(F)35Release  film钢片SUS250mm*100m
    PH35-500K(F)35Release  film钢片SUS500mm*100m
    PH35-250A1(A) 35Release  filmPI/FR4250mm*200m
    PH35-500A1(A) 35Release  filmPI/FR4500mm*100m
    PH40-250K(F)40Release  film钢片SUS250mm*100m
    PH40-500K(F)40Release  film钢片SUS500mm*100m
    PH40-250A1(A)35Release  filmPI/FR4250mm*200m
    PH50-250K(F)50Release  film钢片SUS250mm*100m
    PH50-500K(F)50Release  film钢片SUS500mm*100m
    PH50-250A1(A) 50Release  filmPI/FR4250mm*200m
    PH50-500A1(A) 50Release  filmPI/FR4500mm*100m

    Data Download: